解碼 AI 算力革命與跨域融合!2026 筑波三界技術應用論壇 (ATAF) 盛大登場匯聚國際科技巨擘、臨床醫療專家,全面佈局高頻通訊、先進半導體與智慧醫療生態系

筑波三界應用論壇首次舉行,董事長許深福開幕致詞

【2026 年 8 月 13 日/新竹訊】 全球處於 AI 算力革命與技術融合的關鍵轉折點,跨領域整合已成為企業核心競爭力關鍵。筑波集團8月12日憑藉無線通訊、先進半導體檢測及智慧醫療深厚底蘊主辦年度盛會「2026 筑波三界技術應用論壇 (ATAF, ACE Technology Application Forum)」。以建構「三界技術產業鏈」為核心,匯聚全球科技大廠、產業專家、臨床醫學領袖及學術先驅,三大亮點吸引超過 300 位貴賓共襄盛舉,為跨產業的決策者創造面對面交流與跨界合作的精準商機。

亮點一:高頻通訊與機器人技術-佈局次世代連結與 Physical AI 新未來

全球無線晶片廠商應對未來佈局,深入探討工業自動化中「萬物聯網」的無線通訊尖端應用;面對缺工與生產力需求爆炸,自主移動機器人(AMR)在高科技產業中的精準避障、自動搬運、上下料等轉型實踐策略,以及藉由機器人模擬技術讓如NVIDIA Physical AI成真;此外,隨著SpaceX等國際太空大廠IPO後,太空科技與高頻通訊需求邁入白熱化階段,都讓太赫茲(THz)、毫米波、低軌衛星通訊的技術創新趨勢,有了描繪次世代連結宏偉藍圖的機會與舞台。

關鍵單位:高通(Qualcomm)、泰瑞達(Teradyne Robotics)、工研院(ITRI)、Virginia Diodes(VDI)、LitePoint 及 Yole Group

亮點二:半導體、先進材料與矽光子技術-突破算力瓶頸的關鍵物理技術

面對 AI 算力大爆發帶來的散熱與傳輸瓶頸,前瞻技術開發與實際導入產線應用的討論及執行,讓半導體製造、封測等關鍵產業要角,聯手剖析高效能運算(HPC)下的先進封裝良率、缺陷檢測技術落地;同時,如何導入無光罩黃光系統,及在光電轉換的伺服器機櫃Scale up、Scale Out、Scale Across執行上,會遇到高頻寬、低延遲優勢的「矽光子(Silicon Photonics)」創新技術,在在為次世代晶片效能提供關鍵驅動力。

關鍵單位:日月光半導體(ASE)與 TherMap Solutions、蔡司台灣(ZEISS)、科毅(M&R)、優貝克(ULVAC)、工研院(ITRI)、陽明交大團隊

亮點三:智慧醫療與 AI 應用-落地科技賦能,開啟精準醫療新篇章

新世代智慧醫療產業,處處可見充分展現臨床需要與創新技術的完美結合。臨床專家及國際生態成員,分享耳科疾病 AI 輔助診斷、麻醉科病人安全方案的落地,利用智慧監測系統,在手術全療程中即時預測病人生理狀態,大幅降低手術風險,以及產業最聚焦的臨床轉型實務;在遠距醫療面向上,5G 遠距手術機器人的劃時代應用已然成真且快速推進中;智慧醫療方案的臨床落地價值、婦女健康如生育最佳時機、子宮內膜奧秘醫療保健的重大突破、胰臟癌精準醫療的推進與研究,以及在週日及國定假日輕急症中心(UCC 2.0)的數據串流解密,令各醫院間的電子病歷與檢驗數據能即時互通、無縫接軌轉診,並實現FHIR標準的醫療數據互通新願景,全都在ATAF有很直效地剖析與映證。

關鍵單位:衛福部、筑波醫電、新竹臺大分院、新光醫院、國軍桃園總醫院、成大醫學院、微創醫療(MicroPort)、飛利浦(Philips)。

筑波集團表示,科技的未來在於打破藩籬,本次 ATAF 論壇不僅是一場技術發表,更是搭建起通訊、半導體與醫療「三界」融合的媒合平台。筑波將攜手全球先驅夥伴,在 AI 浪潮中精準卡位、拓展全新視野。

首屆筑波三界應用論壇,超過3百位產官學貴賓參與
台灣科學園區科學工業同業公會王永壯秘書長開幕致詞

Decoding the AI Computing Revolution and Cross-Industry Convergence: 2026 ACE Technology Application Forum Brings Together 300+ Industry Leaders

Photo: The inaugural ACE Technology Application Forum brought together more than 300 representatives from industry, government, academia, and the medical community.

The world is entering a pivotal phase of the AI computing revolution, where technological convergence and cross-industry integration are becoming critical drivers of business competitiveness. On August 12, ACE Group hosted the inaugural 2026 ACE Technology Application Forum (ATAF), drawing on its extensive expertise in wireless communications, advanced semiconductor testing, and smart healthcare.

Themed around the development of an integrated technology ecosystem spanning three key domains, ATAF brought together technology leaders, industry experts, clinical professionals, and academic researchers to explore emerging technologies and real-world applications across communications, semiconductors, and healthcare. The forum attracted more than 300 attendees and created opportunities for decision-makers across industries to exchange insights, identify emerging trends, and explore cross-sector collaboration.

Highlight 1: High-Frequency Communications and Robotics — Enabling Next-Generation Connectivity and Physical AI

The first session explored emerging wireless technologies and their role in the next generation of industrial connectivity. As manufacturers face labor shortages and growing demands for productivity and automation, autonomous mobile robots (AMRs) are increasingly being deployed in high-tech manufacturing environments for applications such as obstacle avoidance, material handling, and automated loading and unloading.


The session also examined how robotics simulation and digital technologies are accelerating the development and deployment of Physical AI, enabling robots to better perceive, interact with, and adapt to real-world environments.


At the same time, growing demand for space technology and high-frequency communications is driving innovation in advanced wireless technologies. Developments in terahertz (THz), millimeter-wave, and low Earth orbit (LEO) satellite communications are opening new possibilities for next-generation connectivity and high-frequency applications.

Highlight 2: Semiconductors, Advanced Materials and Silicon Photonics — Enabling the Next Era of Computing

As the rapid growth of AI computing drives increasingly demanding requirements for data transmission and thermal management, advanced semiconductor technologies are becoming critical to overcoming performance bottlenecks. The second session focused on the development and practical implementation of advanced technologies across semiconductor manufacturing, packaging, and testing.


Industry experts discussed advanced packaging technologies for high-performance computing (HPC), including yield optimization and defect inspection, as well as emerging approaches for semiconductor manufacturing and process development.


The session also highlighted the growing role of silicon photonics in high-performance data communication. With its advantages in high bandwidth and low latency, silicon photonics is emerging as a key technology for optical interconnects and data center architectures, supporting scale-up, scale-out, and scale-across computing configurations. These developments are expected to play an increasingly important role in enabling the performance and scalability required by next-generation AI systems.

Highlight 3: Smart Healthcare and AI Applications — Transforming Clinical Practice Through Technology

The third session focused on the practical implementation of AI and digital technologies in healthcare, highlighting how innovative technologies can address real-world clinical needs and improve patient care.


Topics included AI-assisted diagnosis for otologic diseases and patient safety solutions in anesthesiology. Smart monitoring technologies can continuously track physiological conditions throughout surgical procedures and provide real-time insights to help predict changes in patient status and reduce procedural risks.The session also explored the rapid development of 5G-enabled remote surgery and robotic systems, demonstrating the potential of advanced connectivity to expand access to specialized medical expertise.


Other discussions addressed clinical applications in women’s health, including fertility and endometrial health, as well as advances in precision medicine for pancreatic cancer. The forum also examined data interoperability for urgent care services, including the UCC 2.0 model, and how real-time exchange of electronic medical records and laboratory data between healthcare institutions can support seamless referrals and improve continuity of care through standards such as FHIR (Fast Healthcare Interoperability Resources). ACE Group stated that the future of technology lies in breaking down traditional boundaries between industries. ATAF goes beyond a technology forum by serving as a platform for convergence across communications, semiconductors, and healthcare. By connecting global technology leaders and industry pioneers, ACE aims to identify emerging opportunities, accelerate technology adoption, and expand new possibilities in the era of AI.

 Photo: ACE Group Chairman Steve Hsu delivers the opening remarks at the inaugural ACE Technology Application Forum.
Photo: Wang Yung-Chuang, Secretary General of the Association of Science Park Industries, delivers opening remarks.
Photo: The ACE Technology Application Forum featured a diverse range of technology demonstration areas.