作者: editor

Dr. Don Arnone is the CEO of TeraView. In March 2023, he visited ACE Solution (ACE), the Taiwan representative partner that launched the TZ6000, a non-destructive wafer quality measurement tool. It incorporates with TeraView’s TeraPulse Lx technologies, particularly for crucial applications such as wafer and substrate defect inspection. TZ6000 characterizes the wafer properties by thickness, refractive index, resistivity, dielectric constant, and surface/subsurface defects scanning graph.

Key Driving Factors for TZ6000 Success and Market Advantages

To explore the market for TZ6000, Dr. Don Arnone shares two influencing factors: ” One is to transmit product information; the other is to make a demonstration to customer in terms of favorable impression.” Since 2023, the proof of concept (POC), the initial sales, will rely on sturdy teamwork. Based on ACE and TeraView professionals, TZ6000 is the thriving base for forward-looking. TeraView possesses competitive advantages of Terahertz instrument experience, while ACE has tremendous expertise for integration solutions such as TZ6000. Under the two leading companies’ cross-border cooperation, it will bring an unprecedented solution for customers.

Subsurface Damage (SSD) of semiconductor wafers commonly happens in the surface machining process. At present, wafer inspection relies on VIS/IR/UV optical inspection that can analyze the surface properties of the wafer but not the SSD because of its low penetration depth. Terahertz (THz) waves have the features of high penetration depth in semiconductor wafers for silicon, silicon carbide, and gallium nitride. Therefore, THz-based TZ6000 can meet the market needs for compound semiconductor wafer non-destructive inspection.

TZ6000 Accomplishment Insights from ACE and TeraView

From Dr. Don Arnone’s viewpoint, there are three takeaways for TZ6000 task achievement. ACE works enthusiastically and hard to reach our milestones and follows customer requirements. In addition, team flexibility brings the capability to address the challenge of market adoption. These factors are also key to take the TZ6000 from the project phase through to final commercialization. TeraView’s TeraPulse Lx System is the pioneer product for terahertz analysis. Specifically, it meets material inspection in imaging or spectroscopy applications for the compound semiconductor industry. The modular architecture and patented laser-gated photoconductive emitters and detectors are flexible and expandable. The system also boasts an industry-leading 3,200 ps time-delay line as standard. With a lightweight, compact core unit that allows easy transport, the TeraPulse Lx System incorporates the TeraPulse Lx modules to meet market demands.

Steve Hsu, President of ACE, says it’s a precious chance to collaborate with TeraView. ACE takes the lead in electrical precision tests, integrating service and solution. Through the TeraPulase Lx module and TZ6000 system incorporation, it frames a unique THz-TDS probe for simultaneous measurement of multiple parameters of wafer characterization. In the wafer manufacturing and R&D process, TZ6000 possesses user-friendly and graphically illustrated software for quality inspection. “TeraView and ACE have very complimentary skills and experience. Our partnership is a representative case of international cooperation. I’m proud of this unique accomplishment and enjoying working with President Steve’s team.”, Dr. Don Arnone says with trust. Starting the TZ6000 business in Taiwan, ACE has confidence in creating a great business via technology integration in the long run.